Press "Enter" to skip to content

Intel Accelerates Process and Packaging Innovations

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power…

This content is viewable by members only. Visit MY ACCOUNT on the top menu to log in or to register for a 30 day free trial or purchase a subscription for UV Reporter 1 Year Single Membership or UV Reporter 1 Year Group Membership - $189 for first member and $25 for each additional member.